20W MOPA Fiber Laser Marking IMEI on iPhone Back Cover
iPhone back cover IMEI laser marking need to use 20W MOPA fiber laser marking machine. Other laser source will easily lead to deformation of the material.
3D fiber laser marking system is used to engrave variety 3D surfaces such as bevel, segmentation, cylinder, cone, sphere, curved surface, and more applications.
3D laser marking is a laser surface depression processing method. Compared with traditional 2D laser marking, 3D marking has greatly reduced the surface flatness requirements of the processed object, and the processing effects are more colorful and more creative. Processing technology came into being.
3D laser marking machine is suitable for all kinds of metal and nonmetal materials laser marking on 3D surface. It’s widely used in mobile manufacture, cubic circuits, medical equipments, moulds, 3C electronics, auto parts, electronic communication, etc.
Technical Parameters
Aperture<8 mm
Dynamic performance
Tracking error 0.16 ms
Step response time (settling to 1/1000 of full scale)
1% of full scale 0.40 ms
10%of full scale 1.2 ms
Typical speeds
Marking speed 2.0 m/s
Positioning speed 10.0 m/s
Weight (without objective) 3 kg
f=160 f-theta lens (110*110) DOF ±30
f=254 f-theta lens (174*174) DOF ±50
Common Specifications
(all angles are in optical degrees)
Dynamic performance
Repeatability (RMS) < 2 µrad
Offset drift < 30 µrad/K
Gain drift < 80 ppm/K
Long-term drift over 8 hours < 0.3 mrad
Optical performance
Typical scan angle ±0.35 rad
Gain error < 5 mrad
Zero offset < 5 mrad
Nonlinearity < 3.5 mrad / 44°
Power requirements
For XY ±15 V DC, max. 3 A each
For Z 24V 3A
Digital version XY2-100
Operating temperature 25 °C ± 10 °C
iPhone back cover IMEI laser marking need to use 20W MOPA fiber laser marking machine. Other laser source will easily lead to deformation of the material.
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